Designed to filter connectors, a new chip-on-Flex (COF) from the Technology ITT, Electronic Components (Santa Ana, CA) to replace the fragile ceramic capacitor array with a flexible circuit of the chip capacitors are surface mounted on a pillow next to the feed through contact. Because feed-through contacts are not welded directly to the condenser, points of tension are greatly reduced or eliminated.
Filter connectors use ceramic planar arrays, typically consisting of a ceramic block plated through holes where feed-through contacts are welded. Ceramic caps were chosen to reduce costs (by using the filters on each contact). But the ceramic material is sensitive to the adverse effects caused by shock, vibration and thermal extremes.
The connector on the left uses a ceramic matrix planar configuration, while the connector on the right shows ITT Chip-on-flex filter connector.
COF established connectors offer all the standard filtering capabilities, including filtering isolated pawn of high-frequency sound, built in the ground-level barriers in the connector inserts, and filtering the face of the system crates . Connectors to a barrier errant signal before and away from electronic devices.
COF ITT approach provides flexibility in determining individual designers or change the capacity of the circuit, ground and electromagnetic pulse (EMP) benefits during the design / development phase to eliminate the need to reorganize ceramic planar array. Also, while the tables are ceramic flat hand welded, welding the connectors is automatically built with this new approach.
COF technology gives users a customizable. For example, EMP protection can be added by the substitution of a Zener diode for a chip capacitor. Cut-in frequency is adjustable from the mitigation performance curves.
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